Philips
National Semiconductor
Zetex Semiconductors
ETC
Amkor Technology
MaximIntegratedProducts
ETC
National Semiconductor
Fujitsu Media Devices
Fujitsu Media Devices
| Manufacture | Part Number | Description |
|---|---|---|
|
Philips |
|
Package outline |
|
National Semiconductor |
|
16 Lead Molded Thin Shrink Small Outline Package |
|
Zetex Semiconductors |
|
Surface mounted / 5 pin package Package outline |
|
ETC |
|
PACKAGE OUTLINE DIMENSIONS |
|
Amkor Technology |
|
Ceramic Small Outline Integrated Circuit Package |
|
MaximIntegratedProducts |
|
PACKAGEOUTLINE |
|
ETC |
|
Package Outline Drawing Transistor Outline |
|
National Semiconductor |
|
48 Lead Molded Thin Shrink Small Outline Package |
|
Fujitsu Media Devices |
|
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC |
|
Fujitsu Media Devices |
|
SMALL OUTLINE L-LEADED PACKAGE |
| Total 46 results |